Isa, Japan

Kenji Fukuda


 

Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2019-2025

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6 patents (USPTO):Explore Patents

Title: Kenji Fukuda: Innovator in Infrared Absorbing Materials

Introduction

Kenji Fukuda is a prominent inventor based in Isa, Japan. He has made significant contributions to the field of materials science, particularly in the development of infrared absorbing materials. With a total of 6 patents to his name, Fukuda's work has implications for various applications, including adhesive technologies and shielding films.

Latest Patents

Fukuda's latest patents include an innovative infrared absorbing material fine particle dispersion liquid. This dispersion liquid comprises fine particles of composite tungsten oxide and a solvent, specifically water. The unique feature of this invention is that the absolute value of the zeta potential of the dispersion liquid is between 5 mV and 100 mV. Another notable patent involves an adhesive layer that incorporates composite tungsten oxide particles, a dispersant, a metal coupling agent, an adhesive agent, and a cross-linking agent. This invention aims to enhance the performance of adhesive technologies in various applications.

Career Highlights

Kenji Fukuda is currently associated with Sumitomo Metal Mining Company, Ltd., where he continues to innovate and develop new materials. His work has been instrumental in advancing the understanding and application of tungsten oxide in various industries.

Collaborations

Fukuda has collaborated with notable colleagues, including Hiroki Nakayama and Hideaki Fukuyama. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Kenji Fukuda's contributions to the field of infrared absorbing materials and adhesive technologies highlight his innovative spirit and dedication to advancing material science. His patents reflect a commitment to developing solutions that address modern technological challenges.

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