Kenji Edazawa

Title: Kenji Edazawa: Innovator in Semiconductor Bonding Technology

Introduction

Kenji Edazawa is a notable inventor based in Iruma, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the manufacturing of bonded structures involving film substrates and semiconductor chips. His innovative approach has led to advancements that enhance the reliability and performance of electronic devices.

Latest Patents

Kenji Edazawa holds a patent for a "Method of manufacturing bonded structure of film substrate and semiconductor chip." This patent describes a technique where the bonding conditions for attaching a semiconductor chip to a film substrate are meticulously controlled. The method allows an adhesive positioned beneath the junction between the first connection terminal of the film substrate and the bump electrode of the semiconductor chip to be pushed out, creating an opening in the adhesive layer. This design ensures that the junction floats above the adhesive layer, which helps prevent cracks caused by differences in thermal expansion coefficients. Consequently, this innovation guarantees a robust electrical connection.

Career Highlights

Throughout his career, Kenji Edazawa has been associated with Casio Computer Co., Ltd., where he has applied his expertise in semiconductor technology. His work has been instrumental in developing reliable electronic components that are essential for modern devices.

Collaborations

Kenji has collaborated with talented individuals such as Shiro Ozaki and Kazuhiro Sugiyama. Their combined efforts have contributed to the advancement of technology in their field.

Conclusion

Kenji Edazawa's innovative work in semiconductor bonding technology exemplifies the impact of dedicated inventors in the electronics industry. His patent not only addresses critical challenges in manufacturing but also enhances the overall performance of electronic devices.