Company Filing History:
Years Active: 2018
Title: Kenichirou Imai: Innovator in Refill Container Technology
Introduction
Kenichirou Imai is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs for refill containers. His work has garnered attention for its practicality and efficiency in product delivery.
Latest Patents
Imai holds a patent for a refill container that features a unique design. The refill container includes a sheet of lamination body that consists of a base material and a sealant layer, along with a pouring nozzle seal portion. The lamination body is ingeniously folded to ensure that the sealant layer is arranged inward. The design allows for a secure seal at the peripheral portion of the surface lamination body and the rear surface lamination body. This innovative structure forms a pouring nozzle that facilitates the easy dispensing of contents. The tip of the pouring nozzle is sealed by a pouring-nozzle tip seal portion, which can be detached along an opening line to create a pouring opening. Additionally, the design incorporates easily cutting processing that forms multiple half-cutting lines parallel to the opening line, allowing for convenient use.
Career Highlights
Kenichirou Imai is currently associated with Toppan Printing Co., Ltd., where he continues to develop innovative packaging solutions. His work at Toppan has positioned him as a key player in the advancement of refill container technology.
Collaborations
Imai has collaborated with talented coworkers such as Hiroyuki Otsuka and Youko Koide. Their combined expertise has contributed to the successful development of innovative packaging solutions.
Conclusion
Kenichirou Imai's contributions to refill container technology exemplify his commitment to innovation in packaging. His patent reflects a thoughtful approach to design that enhances usability and efficiency. Imai's work continues to influence the industry and pave the way for future advancements in packaging technology.