Company Filing History:
Years Active: 2012-2013
Title: Kenichi Ohga: Innovator in Multilayer Printed Board Technology
Introduction
Kenichi Ohga is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of printed board technology, holding a total of 2 patents. His work focuses on enhancing the reliability and efficiency of multilayer printed boards.
Latest Patents
Ohga's latest patents include innovative designs and methods for manufacturing multilayer printed boards. One of his notable inventions is a multilayer printed board that features three single-sided conductor pattern films. Each film has a conductor pattern formed on one surface of a resin film, which includes a through hole filled with a conductor. This design allows for improved interlayer connection reliability by electrically connecting the conductor patterns via the filled through holes.
Another significant patent is for a method of manufacturing a metal clad laminate. This process involves forming a foundation layer on a flexible thermoplastic polymer film and subsequently adding an upper layer through plating. The resulting metal clad laminate exhibits unique properties, including shrinkage in the planar direction during the heating process, which enhances its performance.
Career Highlights
Kenichi Ohga is currently employed at The Furukawa Electric Co., Ltd., where he continues to innovate in the field of electrical engineering. His work has been instrumental in advancing technologies related to printed circuit boards and laminates.
Collaborations
Ohga has collaborated with notable colleagues, including Satoru Zama and Akira Tachibana. Their combined expertise has contributed to the successful development of advanced technologies in their field.
Conclusion
Kenichi Ohga's contributions to multilayer printed board technology and metal clad laminates highlight his role as a key innovator in the industry. His patents reflect a commitment to enhancing the reliability and efficiency of electronic components.