Kenichi Nishiyama

Title: Kenichi Nishiyama: Innovator in Semiconductor Technology

Introduction

Kenichi Nishiyama is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that enhances the manufacturing process of semiconductor devices.

Latest Patents

Nishiyama holds a patent for a semiconductor device and method of manufacturing the same. This invention involves bonding a semiconductor chip onto a die pad portion of a lead frame that includes nickel/palladium/gold stacked plate layers. The first bonding procedure utilizes a metal wire of gold pressed against an electrode pad of the semiconductor chip while applying a load of approximately 60 g and ultrasonic waves with a power of approximately 55 mW using a bonding tool. The second bonding procedure involves pressing the metal wire against an inner lead portion of the lead frame while applying a load between 150 and 250 g and ultrasonic waves with a power ranging from 0 to 20 mW. This method allows for firm bonding in a short period without causing peeling of the gold plate layer.

Career Highlights

Kenichi Nishiyama is associated with Matsushita Electronics Corporation, where he has been instrumental in advancing semiconductor technologies. His work has contributed to the efficiency and reliability of semiconductor devices, making a lasting impact in the industry.

Collaborations

Nishiyama has collaborated with notable colleagues such as Sadayoshi Arakawa and Seiichi Ito. Their combined expertise has fostered innovation and development in semiconductor technology.

Conclusion

Kenichi Nishiyama's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work continues to influence the manufacturing processes of semiconductor devices, showcasing the importance of innovation in technology.