Company Filing History:
Years Active: 1999-2002
Title: Ken S Chen: Innovator in Metallization Processes
Introduction
Ken S Chen is a prominent inventor based in Albuquerque, NM (US). He has made significant contributions to the field of metallization processes, holding a total of 2 patents. His innovative approaches have advanced the methods used in applying metallic coatings to various substrates.
Latest Patents
Ken S Chen's latest patents include two notable processes for metallization of substrates. The first patent, titled "Process for metallization of a substrate by curing a catalyst applied thereto," describes an improved additive process where a catalyst solution is applied to a substrate's surface. By heating the substrate, metallic catalytic clusters can form in the catalyst solution, allowing for electroless plating to deposit metal onto the coated surface. Additional metallization thickness can be achieved through electrolytic plating after the electroless plating step. The second patent, "Process for metallization of a substrate by irradiative curing of a catalyst," outlines a similar process but utilizes irradiation to form metallic clusters on the substrate surface. This method also allows for electroless plating and subsequent electrolytic plating to enhance the metallization thickness.
Career Highlights
Ken S Chen is currently employed at Sandia Corporation, where he continues to develop innovative metallization techniques. His work has been instrumental in improving the efficiency and effectiveness of substrate metallization processes.
Collaborations
Ken has collaborated with notable colleagues, including William P Morgan and John L Zich, contributing to advancements in their shared field of expertise.
Conclusion
Ken S Chen's contributions to metallization processes through his patents and work at Sandia Corporation highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of substrate metallization.