Company Filing History:
Years Active: 1998-2000
Title: Ken Iwasaki: Innovator in Electronic Devices and Semiconductor Packages
Introduction
Ken Iwasaki is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of electronic devices and semiconductor packaging. With a total of 2 patents to his name, Iwasaki's work focuses on improving the reliability and performance of electronic components.
Latest Patents
Iwasaki's latest patents include innovative designs for electronic devices and semiconductor packages. One of his patents describes an electronic device that features a semiconductor package mounted on a motherboard. This design incorporates a shape-holding plate, or stiffener, made from a metal with a thermal expansion coefficient closely matching that of the glass-epoxy wiring substrate. This approach helps to relieve stress caused by cyclic thermal loads on solder bumps that connect the semiconductor package to the motherboard.
Another patent outlines a semiconductor package that includes a buffer layer to alleviate stress resulting from differences in physical properties between the semiconductor package and the motherboard. This buffer layer is designed to have a thermal expansion coefficient similar to that of the motherboard, enhancing the reliability of the connection in real-world applications.
Career Highlights
Ken Iwasaki is currently employed at Kabushiki Kaisha Toshiba, where he continues to innovate in the field of electronics. His work has been instrumental in developing technologies that enhance the performance and durability of electronic devices.
Collaborations
Iwasaki has collaborated with notable colleagues such as Morihiko Ikemizu and Nobuaki Oie. Their combined expertise has contributed to the advancement of semiconductor technology and electronic device design.
Conclusion
Ken Iwasaki is a prominent figure in the realm of electronic devices and semiconductor packaging. His innovative patents and collaborations reflect his commitment to enhancing the reliability and performance of electronic components. His contributions continue to shape the future of technology in this field.