Kawasaki, Japan

Ken'ichi Ishizaka


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Ken'ichi Ishizaka: Innovator in Heat Exchange Technology

Introduction

Ken'ichi Ishizaka is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of electronic systems, particularly in the area of heat exchange devices. His innovative work has led to the development of a patented technology that enhances the efficiency of electronic devices.

Latest Patents

Ishizaka holds a patent for a heat exchange device, electronic system, and cooling method of an electronic system. This invention addresses the challenges associated with heat generation in electronic components. The heat exchange device is designed to be coupled with an electronic device that generates heat. It features a first channel for the flow of a first coolant, a heat exchange unit for performing heat exchange between the first coolant and a second coolant, and a second channel for the second coolant. Additionally, it includes a first coolant detection unit to detect any leakage, a collection unit for the leaked coolant, a storage unit to supply the stored coolant, and a recovery unit to recover the leaked coolant back into the storage unit when leakage is detected.

Career Highlights

Ken'ichi Ishizaka is currently employed at Fujitsu Corporation, where he continues to innovate and develop advanced technologies. His work at Fujitsu has allowed him to collaborate with other talented engineers and researchers in the field.

Collaborations

Some of his notable coworkers include Hiroshi Ishikawa and Tadao Amada. Their collaborative efforts contribute to the advancement of technology within the company.

Conclusion

Ken'ichi Ishizaka's contributions to heat exchange technology exemplify the importance of innovation in the electronic industry. His patented inventions not only improve the efficiency of electronic devices but also pave the way for future advancements in cooling methods.

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