Ken-Hsiung Hsu

Title: Ken-Hsiung Hsu: Innovator in Heat Dissipation Technologies

Introduction

Ken-Hsiung Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, particularly in heat dissipation technologies. With a total of 2 patents, Hsu's work focuses on enhancing the efficiency and effectiveness of heat management in electronic devices.

Latest Patents

Hsu's latest patents include a dual-sided heat dissipating structure for integrated circuit packages. This innovative design features a step-shaped first heat dissipating member that adheres to the active side of the chip, along with a dish-shaped perforated second heat dissipating member on the non-active side. This configuration allows for more effective heat dissipation, addressing issues such as moisture escape to prevent the pop corn effect during IR Reflow tests. Additionally, he has developed a thin enhanced TAB BGA package that incorporates an IC chip and a substrate with a center opening. This design not only improves heat dissipation but also reduces production costs by allowing simultaneous bonding processes.

Career Highlights

Throughout his career, Ken-Hsiung Hsu has worked with various companies, including First International Computer, Inc. His experience in the industry has equipped him with the knowledge and skills necessary to innovate in the field of electronic packaging.

Collaborations

Hsu has collaborated with notable colleagues such as Tsung-Chieh Chen and Yi-Liang Peng. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Ken-Hsiung Hsu is a prominent figure in the realm of heat dissipation technologies for integrated circuits. His innovative patents and collaborative efforts highlight his commitment to improving electronic packaging solutions.