Kelvin Liu

Title: Innovations by Inventor Kelvin Liu

Introduction

Kelvin Liu is an accomplished inventor based in San Diego, CA. He has made significant contributions to the field of sensor technology, particularly through his innovative patent that enhances sensor performance. His work focuses on creating efficient and cost-effective solutions for sensor assemblies.

Latest Patents

Kelvin Liu holds a patent titled "Method of making through-hole vias in a substrate." This invention pertains to a sensor assembly designed for microfabricated resonant sensors. The assembly provides improved performance by creating a thermally insensitive environment and establishing short pathways for signals to travel to processing components. The modular construction of the assembly allows for the easy replacement of sensors, reducing costs. The sensor module includes a sensor formed on a conductive substrate with a cavity, and conductive vias extend from the cavity to the substrate's second surface. A rigid housing, preferably made from ceramic, accommodates the sensor, and an electronic component, such as an amplifier, is mounted on the housing to process signals received from the sensor.

Career Highlights

Kelvin Liu is currently employed at Bioscale, Inc., where he continues to innovate in the field of sensor technology. His work has been instrumental in advancing the capabilities of microfabricated sensors, making them more efficient and reliable.

Collaborations

Kelvin collaborates with talented individuals such as Colby Bellew and Boyce E Collins, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Kelvin Liu's contributions to sensor technology through his patent demonstrate his commitment to innovation and excellence in engineering. His work not only enhances sensor performance but also offers cost-effective solutions for the industry.