This inventor holds 1 USPTO granted patent and 2 published patent applications and 1 EPO patent. Top assignee: Denso Corporation. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Keiko Okuda - Innovator in Fiber Aggregate Technology
Introduction
Keiko Okuda is a notable inventor based in Chuo-ku, Tokyo, Japan. She has made significant contributions to the field of materials science, particularly in the development of fiber aggregates for molding applications. Her innovative approach aims to enhance the performance characteristics of molded articles.
Latest Patent Applications
Keiko Okuda's most recent patent application is titled "FIBER AGGREGATE FOR MOLDING." The objective of this invention is to provide a fiber aggregate that results in molded articles with satisfactory appearance, excellent stiffness, strength against bending, and superior impact resistance. The fiber aggregate comprises a fiber component, which includes pulp fiber and polypropylene fiber, along with a thermal fusion bonding resin component. This resin component is selected from polyethylene and acid-modified polyethylene, with a specified content range of 3% to 18% by mass. Furthermore, the invention defines a specific tensile strength ratio (T/Y) to ensure optimal performance in different directions.
Conclusion
Keiko Okuda's work in fiber aggregate technology showcases her commitment to innovation and excellence in material development. Her contributions have the potential to significantly impact the manufacturing of molded articles, enhancing their durability and aesthetic appeal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile