Tokyo, Japan

Keiki Ariga


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 63(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: Keiki Ariga: Innovator in Thermal Insulation Technology

Introduction

Keiki Ariga is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal insulation technology, particularly through his innovative methods for creating double-walled insulating metal containers. His work is recognized for its practical applications in various industries.

Latest Patents

Ariga holds a patent for a "Method for making double-walled insulating metal container." This invention relates to a method of making a double-walled thermally insulating metal container comprising an inner casing and an outer casing having an evacuation opening. A quantity of joining material is placed near or on the evacuation opening so as to cover the opening partially or completely. The assembly is treated in a vacuum furnace to evacuate the insulating space, to melt the joining material, and to solidify the joining material in situ to provide vacuum sealing without resorting to a conventional sealing plate. He has 1 patent to his name.

Career Highlights

Ariga is associated with Nippon Sanso Corporation, where he has been able to apply his innovative ideas in a professional setting. His work has contributed to advancements in the manufacturing of thermal insulation products, enhancing their efficiency and effectiveness.

Collaborations

Throughout his career, Ariga has collaborated with notable colleagues such as Shouji Toida and Shigeru Tsuchiya. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Keiki Ariga is a distinguished inventor whose work in thermal insulation technology has made a significant impact. His innovative methods and collaborations continue to influence the industry, showcasing the importance of creativity and teamwork in advancing technology.

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