Niihari, Japan

Keiitsu Kobayashi


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 24(Granted Patents)


Location History:

  • Ayase, JP (1985)
  • Niihari, JP (1991)

Company Filing History:


Years Active: 1985-1991

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2 patents (USPTO):Explore Patents

Title: Keiitsu Kobayashi: Innovator in Packaging Technology

Introduction

Keiitsu Kobayashi is a notable inventor based in Niihari, Japan. He has made significant contributions to the field of packaging technology, particularly through his innovative patents. With a total of 2 patents, Kobayashi has focused on developing materials that enhance the performance and efficiency of packaging solutions.

Latest Patents

Kobayashi's latest patents include a low-temperature heat-shrinkable film and a packaging cloth. The low-temperature heat-shrinkable film is characterized by a haze value not larger than 8%, a heat shrinkability in the machine direction at a temperature of 90°C of at least 30%, and a shrinkage stress of at least 300 g/mm². This film is made from a composition that includes a linear ethylene polymer and an ethylene/propylene random copolymer. The packaging cloth, on the other hand, is made from a woven or knitted fabric that utilizes thread or tape obtained by melt extrusion of a linear low-density ethylene polymer. This cloth boasts improved tear strength and notch propagation resistance.

Career Highlights

Throughout his career, Kobayashi has worked with prominent companies such as Showa Denko K.K. and Taisei Polymer Co. His experience in these organizations has allowed him to refine his skills and contribute to advancements in packaging materials.

Collaborations

Kobayashi has collaborated with notable coworkers, including Toshio Taka and Takuo Okubo. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Keiitsu Kobayashi's work in packaging technology exemplifies the impact of innovative thinking in material science. His patents reflect a commitment to enhancing the functionality and durability of packaging solutions.

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