Keigo Uhira

Title: Keigo Uhira: Innovator in Bonded Structures

Introduction

Keigo Uhira is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of bonded structures, particularly through his innovative patent that enhances the detection of bonding conditions.

Latest Patents

Uhira holds a patent for a bonded structure and bonding-condition detecting method. This invention includes a first member, a second member, an adhesive that bonds the two members together, and an optical fiber sandwiched between them. When pressure is applied to the optical fiber from a predetermined direction, its sectional shape changes to an elliptical form, resulting in birefringence. This change alters the light spectrum, creating multiple peaks. The optical fiber serves as a sensor to detect the bonding condition between the first and second members based on this birefringence. He has 1 patent to his name.

Career Highlights

Throughout his career, Uhira has worked with prominent organizations, including Mitsubishi Heavy Industries, Ltd. and The University of Tokyo. His experience in these institutions has allowed him to develop and refine his innovative ideas.

Collaborations

Uhira has collaborated with notable colleagues such as Nozomi Saito and Takayuki Shimizu. Their joint efforts have contributed to advancements in the field of bonded structures.

Conclusion

Keigo Uhira's work in bonded structures and his innovative patent demonstrate his significant impact on the field. His contributions continue to influence advancements in technology and engineering.