Company Filing History:
3 out of 78 
2 out of 2 
1 out of 14 Years Active: 2013-2015
Title: Kei Mizuta: Innovator in Heat Management Technologies
Introduction
Kei Mizuta is a notable inventor based in Kagoshima, Japan, recognized for his contributions to heat management technologies. With a total of three patents to his name, Mizuta has made significant advancements in the field of electronic cooling solutions.
Latest Patents
Mizuta's latest patents include a heat sink package and a method of manufacturing that enhances the efficiency of circuit elements. This innovation involves arranging a circuit element on an organic substrate and connecting it to a wiring pattern. An internal connection electrode is formed on a conductive support body through electroforming, creating a unitary block that facilitates effective connections. After sealing the circuit element with resin, the support body is removed, allowing for individual internal connection electrodes to be utilized as external connection points.
Another significant patent focuses on a heat sink, cooling module, and coolable electronic board. This design features a base body that absorbs heat from a heat-generating component. The thermal resistance of the base body is strategically higher in the area opposed to the heat-generating body compared to the surrounding portions, optimizing heat dissipation.
Career Highlights
Throughout his career, Kei Mizuta has worked with esteemed institutions such as Kagoshima University and Fuchigami Micro Co., Ltd. His work in these organizations has contributed to the development of innovative cooling technologies that are essential for modern electronic devices.
Collaborations
Mizuta has collaborated with notable colleagues, including Katsuya Tsuruta and Kenji Ohsawa. Their combined expertise has fostered advancements in the field of heat management.
Conclusion
Kei Mizuta's innovative work in heat management technologies has made a significant impact on the electronics industry. His patents reflect a commitment to improving the efficiency and effectiveness of electronic cooling solutions.