Shanghai, China

Ke Sun

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.2

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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4 patents (USPTO):Explore Patents

Title: Ke Sun: Innovating Liquid Cooling Solutions in Shanghai

Introduction

Ke Sun is an accomplished inventor based in Shanghai, China, renowned for his contributions to liquid cooling technologies. Holding a total of three patents, he has made significant advancements in the field, particularly concerning the efficient management of heat in electronic devices.

Latest Patents

Ke Sun's latest patents include groundbreaking inventions in liquid cooling devices. One notable invention is a liquid cooling device that consists of a base plate, a cooling body, and a cover plate. This innovative design features a cooling layer and a reflux layer with multiple cooling channels and reflux channels that ensure optimal heat management. Another significant patent is for a liquid immersion cooling apparatus, which includes a sealed box that houses a refrigeration device and is designed to accommodate both a coolant and heat-generating devices. These inventions exemplify Sun's dedication to enhancing cooling technologies.

Career Highlights

Throughout his career, Ke Sun has worked with leading corporations such as Inventec Technology Corporation and Inventec Corporation. His work at these companies has allowed him to hone his skills in engineering and innovation, positioning him as a key figure in the development of efficient cooling solutions.

Collaborations

In his professional journey, Ke Sun has collaborated with notable colleagues, including Jiangjun Wu and Pinyi Xiang. These collaborations have fostered a creative environment that has led to the generation of innovative ideas and the successful development of cutting-edge technologies.

Conclusion

Ke Sun's contributions to the field of liquid cooling technologies represent a significant advancement in engineering innovation. With his impressive portfolio of patents and his impactful collaborations, he continues to be a pivotal figure in developing solutions that address the challenges of heat management in electronic devices.

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