Company Filing History:
Years Active: 2016-2019
Title: Kazuya Ichikawa: Innovator in Solder Alloys and Electronic Circuit Boards
Introduction
Kazuya Ichikawa is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of solder alloys and electronic circuit boards. With a total of four patents to his name, Ichikawa's work is recognized for its innovative approaches to materials used in electronics.
Latest Patents
Ichikawa's latest patents focus on advanced solder alloys and their applications. One of his notable inventions is a solder alloy that consists of tin, silver, copper, bismuth, antimony, and cobalt. This alloy has specific content ratios, including 3 mass % to 3.5 mass % silver, 0.4 mass % to 1.0 mass % copper, and 3.5 mass % to 4.8 mass % bismuth, among others. Another patent describes a solder alloy that includes tin, silver, indium, bismuth, and antimony, with precise content ratios for each component, ensuring optimal performance in electronic applications.
Career Highlights
Ichikawa is currently employed at Harima Chemicals, Incorporated, where he continues to develop innovative materials for the electronics industry. His expertise in solder alloys has positioned him as a key figure in advancing technology in this field.
Collaborations
Ichikawa collaborates with talented coworkers, including Kosuke Inoue and Tadashi Takemoto. Their combined efforts contribute to the ongoing research and development of new materials and technologies.
Conclusion
Kazuya Ichikawa's work in solder alloys and electronic circuit boards showcases his dedication to innovation in the electronics industry. His patents reflect a commitment to improving the performance and reliability of electronic components.