Company Filing History:
Years Active: 2010-2011
Title: Kazuo Hujie: Innovator in Wafer Production Technology
Introduction
Kazuo Hujie is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer production technology, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and quality of wafer manufacturing processes.
Latest Patents
Hujie's latest patents include a method for producing a wafer and a bonded wafer. The first patent describes a process where a wafer is polished to flatten a predetermined face while using a specialized polishing liquid on a bonded abrasive cloth. This cloth is made from a urethane bonding material that includes a soft segment with a polyfunctional isocyanate and a hard segment with a polyfunctional polyol. The method also specifies the use of silica with an average particle size of 0.2-10 µm, ensuring a precise ratio of components for optimal performance. The second patent outlines a technique for producing a bonded wafer by bonding an ion-implanted wafer for an active layer onto a supporting substrate. This process involves exfoliating the active layer at the ion-implanted position through heat treatment and polishing to achieve a smooth terrace portion.
Career Highlights
Kazuo Hujie is currently associated with Sumco Corporation, where he continues to innovate in wafer technology. His expertise and dedication to research have positioned him as a key figure in the industry.
Collaborations
Hujie has collaborated with notable colleagues, including Etsurou Morita and Isoroku Ono. Their combined efforts contribute to advancements in wafer production techniques.
Conclusion
Kazuo Hujie's work in wafer production technology exemplifies innovation and dedication to improving manufacturing processes. His patents reflect a commitment to enhancing the quality and efficiency of wafer production, making him a significant contributor to the field.