Kazuo Funahashi

Title: Kazuo Funahashi: Innovator in Semiconductor and Circuit Board Manufacturing

Introduction

Kazuo Funahashi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the fields of semiconductor devices and circuit board manufacturing. With a total of 2 patents, his work has advanced the technology used in these critical areas.

Latest Patents

One of Funahashi's latest patents is a method for manufacturing a resin-sealed power semiconductor device. This invention aims to facilitate the separation of a suspension lead from a mold resin and a lead frame. The method includes several steps, such as sealing a semiconductor element and a lead frame, punching a portion of the suspension lead, and ensuring effective separation from the mold resin.

Another significant patent is a method of manufacturing a circuit print board. This invention seeks to prevent temperature rises in heating elements and the board itself by incorporating a graphite sheet with high thermal conductivity. The method involves forming a thermal diffusive sheet, creating a through hole, and bonding an insulator to the thermal diffusive sheet, allowing for effective thermal management without electrical connection to conductive holes.

Career Highlights

Throughout his career, Kazuo Funahashi has worked with prominent companies, including Mitsubishi Electric Corporation and Mitsubishi Denki Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in semiconductor and circuit board technologies.

Collaborations

Funahashi has collaborated with notable colleagues such as Takashi Kobayashi and Seiji Oka. Their combined efforts have furthered advancements in their respective fields.

Conclusion

Kazuo Funahashi's innovative work in semiconductor and circuit board manufacturing has led to valuable patents that enhance technology in these areas. His contributions continue to influence the industry and pave the way for future advancements.