Tamano, Japan

Kazuki Tanizawa

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Kazuki Tanizawa: Innovator in Thin Film Technology

Introduction

Kazuki Tanizawa is a notable inventor based in Tamano, Japan. He has made significant contributions to the field of thin film technology, particularly through his innovative methods for forming thin films. His work is characterized by a focus on enhancing the efficiency and effectiveness of deposition processes.

Latest Patents

Kazuki Tanizawa holds a patent for a thin film forming method. This method involves introducing an organic metal gas containing hydrogen into a deposition vessel, allowing a component of the organic metal to be adsorbed on a substrate. The process continues with the introduction of an oxidizing gas or a nitriding gas into the vessel, where plasma is generated to oxidize or nitridize the component. The method also includes detecting the emission intensity of light through an observation window, which is crucial for determining the optimal conditions for the deposition process. The generation of plasma is halted when the detected emission intensity reaches a predetermined value, ensuring precision in the formation of oxidized or nitride metals on the substrate.

Career Highlights

Kazuki Tanizawa is currently associated with Mitsui Engineering & Shipbuilding, a company known for its engineering innovations and contributions to various industries. His role at the company allows him to apply his expertise in thin film technology to real-world applications, further advancing the field.

Collaborations

Due to space constraints, the collaborations section has been omitted.

Conclusion

Kazuki Tanizawa's work in thin film technology exemplifies the innovative spirit of modern inventors. His patented methods not only enhance the deposition process but also contribute to advancements in material science. His contributions are significant in shaping the future of thin film applications.

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