Fukuoka-ken, Japan

Kazuki Anada

USPTO Granted Patents = 11 

Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 40(Granted Patents)


Location History:

  • Fukuoka-ken, JP (2014 - 2018)
  • Fukuoka, JP (2019)
  • Kitakyushu, JP (2020)

Company Filing History:


Years Active: 2014-2020

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11 patents (USPTO):Explore Patents

Title: Kazuki Anada: Innovator in Electrostatic Chuck Technology

Introduction

Kazuki Anada is a prominent inventor based in Fukuoka-ken, Japan. He has made significant contributions to the field of electrostatic chuck technology, holding a total of 11 patents. His work focuses on enhancing wafer processing apparatuses, which are crucial in semiconductor manufacturing.

Latest Patents

Anada's latest patents include innovative designs for electrostatic chucks. One embodiment features a ceramic dielectric substrate with a sealing ring at its peripheral edge. This design ensures a uniform spacing between the outer perimeter of the ceramic dielectric substrate and the electrode layer. The sealing ring's width ranges from 0.3 to 3 millimeters, while the overlap width of the electrode layer is between -0.7 and 2 millimeters. Another patent describes an electrostatic chuck that includes a polycrystalline ceramic sintered body, an electrode layer, and a base plate with a heater. This configuration allows for effective temperature control of the object being processed.

Career Highlights

Kazuki Anada is currently employed at Toto Ltd., where he continues to innovate in the field of electrostatic chuck technology. His work has been instrumental in advancing the efficiency and effectiveness of wafer processing systems.

Collaborations

Anada collaborates with talented coworkers, including Takuma Wada and Yuichi Yoshii. Their combined expertise contributes to the development of cutting-edge technologies in their field.

Conclusion

Kazuki Anada's contributions to electrostatic chuck technology have positioned him as a key figure in the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in wafer processing.

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