Chiba, Japan

Katsuhisa Oosaki


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Innovations of Katsuhisa Oosaki in Intermetallic Compounds

Introduction

Katsuhisa Oosaki is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of materials science, particularly in the production of intermetallic compounds. His innovative work has implications in various technical fields, showcasing the potential of these materials in advanced applications.

Latest Patents

Oosaki holds a patent for the "Production of powdery intermetallic compound having very fine particle." This patent describes an intermetallic compound, such as Nb₃Al, which exhibits self-disintegration when hydrogen is adsorbed. The process allows for the autogenous pulverization of the material into very fine particles by adjusting the atmosphere to which it is exposed. The resulting pulverized intermetallic compound has irregular shapes and a large specific surface area, making it useful as a superconductive material, heat-resistant material, magnetic body, or hydrogen-absorbing material.

Career Highlights

Katsuhisa Oosaki is associated with Nisshin Steel Co., Ltd., where he has been able to apply his expertise in materials science. His work has contributed to advancements in the production and application of intermetallic compounds, enhancing their utility in various industries.

Collaborations

Oosaki has collaborated with notable colleagues, including Masahiro Uda and Yoshikazu Morita. These collaborations have likely fostered a rich exchange of ideas and innovations, further advancing the field of materials science.

Conclusion

Katsuhisa Oosaki's contributions to the field of intermetallic compounds highlight the importance of innovation in materials science. His patent and work at Nisshin Steel Co., Ltd. demonstrate the potential applications of these materials in various technical fields.

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