Kaoru Kojima

Title: Kaoru Kojima: Innovator in Copper Plating Solutions

Introduction

Kaoru Kojima is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of materials science, particularly in the area of copper plating solutions. His innovative approach has led to the development of a unique copper plating method that enhances the quality and adhesion of copper films.

Latest Patents

Kojima holds a patent for a copper plating solution and method for copper plating. This solution is characterized by its composition, which includes 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid, and 0.02 mol/L to 0.3 mol/L of sulfite. The pH of the solution is adjusted to a range of 5.0 to 8.5. The method utilizes this copper plating solution to provide a uniform copper plating film that exhibits excellent adhesion on surfaces, such as those of rare earth metal-based permanent magnets.

Career Highlights

Kojima is associated with Hitachi Metals, Ltd., where he has been able to apply his expertise in developing advanced materials. His work has contributed to the company's reputation for innovation in the field of metallurgy and materials engineering.

Collaborations

Kojima has collaborated with notable colleagues, including Fumiaki Kikui and Yoriyoshi Oooka. These collaborations have fostered a productive environment for innovation and have led to advancements in their respective fields.

Conclusion

Kaoru Kojima's contributions to copper plating technology exemplify the impact of innovative thinking in materials science. His patent reflects a commitment to enhancing the quality of industrial processes, making him a significant figure in his field.