Company Filing History:
Years Active: 2002
Title: **Kanae Tokio: Innovating Sn-Cu Alloy Plating for Advanced Applications**
Introduction
Kanae Tokio is an accomplished inventor based in Fujisawa, Japan, recognized for his groundbreaking work in the field of alloy plating. He has made significant contributions to the industry with his innovative patent that focuses on enhancing the efficiency and effectiveness of Sn-Cu alloy plating baths.
Latest Patents
Tokio holds one notable patent titled "Sn-Cu Alloy Plating Bath." This invention details an acidic Sn-Cu alloy plating bath composition which comprises: (a) Sn ions and Cu ions, (b) at least one acid from the group of alkane sulfonic acids, alkanol sulfonic acids, or sulfuric acid, and (c) a thiourea compound. The invention showcases high current efficiency while preventing copper deposition on the tin anode. Importantly, the Sn-Cu alloy plating bath addresses common issues such as inadequate adhesion of plating to the substrate and problems with copper deposits. Moreover, the ease of processing waste water stemming from this composition, due to the absence of complexing agents, highlights its practicality for industrial applications. This technology not only enables the production of Sn-Cu alloy plating but also supports ternary alloy plating with other metals at an industrial scale.
Career Highlights
Tokio is associated with Ebara-udylite Co., Ltd., where he has been actively involved in research and development. His dedication to innovation and improvement in plating techniques has set benchmarks in the industry.
Collaborations
In his journey, Tokio has worked alongside prominent colleagues including Yoshiaki Muramatsu and Yoshihiko Yada. Their collaborative efforts have furthered advancements in the industry, facilitating breakthrough innovations and the development of more efficient plating solutions.
Conclusion
Kanae Tokio's contributions to the field of Sn-Cu alloy plating represent a significant step forward in industrial plating technologies. His innovative approach not only addresses existing challenges but also opens new avenues for research and application in alloy plating, reflecting the continuous evolution of technology within this domain.
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