Shanghai, China

Jyishyang Liu


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: **Inventor Spotlight: Jyishyang Liu from Shanghai, China**

Introduction

Jyishyang Liu is an innovative inventor based in Shanghai, China, who has made significant contributions to the field of semiconductor technology. With a keen focus on developing advanced methods for semiconductor manufacturing, Liu has a unique patent that showcases his expertise and creativity.

Latest Patents

Liu holds a patent for a semiconductor die and die cutting method. This patent details an innovative approach where a semiconductor substrate incorporates various regions including test, isolation, and core regions. The methodology involves forming multiple layers, such as a device layer, interconnection layer, and soldering pad layer, all essential for the semiconductor's functionality. Notably, the soldering layer consists of several soldering pads, which are covered by a passivation layer. This layer is strategically etched to create trenches that facilitate connectivity and disconnection required for effective testing and functioning of the semiconductor device.

Career Highlights

Currently, Jyishyang Liu works at Semiconductor Manufacturing International Corporation (SMIC), a leading semiconductor foundry. His role within the company involves leveraging his expertise to contribute to cutting-edge semiconductor solutions. Liu's career is marked by his dedication to advancing semiconductor technologies, making him a valuable asset to his team and the broader technology industry.

Collaborations

Throughout his career, Liu has collaborated with fellow innovators Xuanjie Liu and Xiaojun Chen. These partnerships have fostered a creative environment where ideas flourish, leading to successful advancements in semiconductor processes and technologies. Such collaborations highlight the importance of teamwork in achieving groundbreaking innovations.

Conclusion

In conclusion, Jyishyang Liu exemplifies the spirit of innovation in the semiconductor industry. His patent for a die cutting method reflects his commitment to developing efficient semiconductor technologies. Liu's collaborative efforts with his colleagues further demonstrate the critical role that teamwork plays in driving advancements in this fast-evolving field. As he continues on his journey, his contributions are sure to have a lasting impact on the semiconductor manufacturing landscape.

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