Company Filing History:
Years Active: 2025
Title: Junmo Koo: Innovator in Semiconductor Packaging
Introduction
Junmo Koo is a prominent inventor based in Hwaseong-si, South Korea. He is known for his contributions to the field of semiconductor packaging, which plays a crucial role in modern electronics. His innovative designs have paved the way for advancements in technology.
Latest Patents
Junmo Koo holds a patent for a semiconductor package. This package includes a base substrate, an interposer package, and first and second semiconductor chips. The interposer package features a first redistribution layer, a bridge chip with a bridge circuit, and a vertical connection structure comprising multiple wiring layers. Each semiconductor chip is electrically connected to the bridge circuit and wiring layers through the first redistribution layer. This invention enhances the efficiency and performance of semiconductor devices.
Career Highlights
Junmo Koo is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to collaborate with some of the brightest minds in the industry. His contributions have significantly impacted the development of semiconductor technologies.
Collaborations
Junmo Koo has worked alongside talented colleagues, including Hongwon Kim and Yeonjoo Kim. Their collaborative efforts have led to innovative solutions in semiconductor packaging.
Conclusion
Junmo Koo's work in semiconductor packaging exemplifies the spirit of innovation in technology. His patent and contributions to Samsung Electronics Co., Ltd. highlight his role as a key player in advancing semiconductor technology.