Tianjin, China

Junhua Luo

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.1

ph-index = 1


Company Filing History:


Years Active: 2013-2015

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6 patents (USPTO):Explore Patents

Title: Junhua Luo - Innovator in Semiconductor Packaging

Introduction

Junhua Luo is a prominent inventor based in Tianjin, China, known for his significant contributions to the field of semiconductor packaging. With a total of 6 patents to his name, he has made remarkable advancements in the design and assembly of semiconductor devices.

Latest Patents

Luo's latest patents include innovative methods for assembling semiconductor devices. One notable patent describes a semiconductor device package with a cap element. This method involves providing a substrate with an array of substrate elements linked by corner elements and separated by slots. Semiconductor dies are positioned on these substrate elements, and a cap, frame, and contact structure are fitted onto the substrate. This assembly allows for efficient electrical connections and encapsulation of the semiconductor dies. Another patent focuses on the method of packaging semiconductor dies with a cap element, detailing the alignment of a cap array structure with an array of semiconductor dies in a mold chase, followed by encapsulation with a molding compound.

Career Highlights

Junhua Luo is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in semiconductor technology. His work has significantly impacted the efficiency and reliability of semiconductor devices, making him a valuable asset to the company.

Collaborations

Luo has collaborated with notable coworkers, including Baoguan Yin and Jinzhong Yao, contributing to various projects that enhance semiconductor packaging techniques.

Conclusion

Junhua Luo's contributions to semiconductor packaging through his innovative patents and collaborative efforts highlight his importance in the field. His work continues to influence the development of advanced semiconductor technologies.

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