Company Filing History:
Years Active: 2022-2025
Title: Innovations of Jungha Lee in Semiconductor Technology
Introduction
Jungha Lee is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to integrated circuit design.
Latest Patents
One of Jungha Lee's latest patents focuses on the interconnection structure of integrated circuit semiconductor devices. This invention includes a first conductive layer on a semiconductor substrate, an interlayer insulating layer that features a trench and a via hole, and a via layer that penetrates the interlayer insulating layer. The via layer is designed to contact the first conductive layer, with a protrusion that extends beyond the height of the trench. Additionally, a barrier layer is selectively placed on the bottom and sidewalls of the trench, along with the sidewalls of the via layer. A cap layer is positioned on the surface of the via layer, and a second conductive layer is situated in the trench on the barrier layer. The cap layer is electrically connected to the first conductive layer through the via layer.
Career Highlights
Jungha Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has contributed to advancements in the efficiency and performance of integrated circuits.
Collaborations
He collaborates with Woojin Jang, a fellow innovator in the field, to further enhance their research and development efforts.
Conclusion
Jungha Lee's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions are paving the way for future advancements in integrated circuit design.