Company Filing History:
Years Active: 2014
Title: Inventor Jung-min Ko: Pioneering Advances in Semiconductor Technology
Introduction
Jung-min Ko is an esteemed inventor based in Seoul, South Korea, recognized for his significant contributions to semiconductor technology. With a keen focus on innovation, he has developed a groundbreaking patent that addresses complex challenges in the semiconductor packaging industry.
Latest Patents
Jung-min Ko holds a patent for "Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages." This inventive technology features a sophisticated structure comprising multiple semiconductor chips stacked on top of one another. The design includes a first underfill layer between the first and second semiconductor chips, a second underfill layer between the second and third chips, and a third underfill layer between the third and fourth chips. Notably, the second underfill layer is composed of a material distinct from those used in the first and third layers, showcasing innovative material application in semiconductor packaging.
Career Highlights
Jung-min Ko is associated with Samsung Electronics Co., Ltd., one of the leading firms in the electronics industry. His role as an inventor at this prestigious company has allowed him to contribute to pioneering technologies that enhance the efficiency and functionality of semiconductor systems. His achievements exemplify a commitment to advancing industry standards through innovative solutions.
Collaborations
Throughout his career, Jung-min Ko has collaborated with accomplished colleagues such as Myun-sung Kang and Sang-Sick Park. These partnerships have fostered a creative environment where valuable ideas and advancements in semiconductor technology are continually developed, benefiting the industry as a whole.
Conclusion
In conclusion, Jung-min Ko stands out as a prominent figure in semiconductor innovation. His patent contributions pave the way for next-generation technologies that enhance the capabilities of electronic devices. As he continues to work with esteemed professionals in the field, the future of semiconductor packaging looks promising under his influence.