Junfeng Zhang

Title: Innovations of Junfeng Zhang in Fluoropolymer Lamination

Introduction

Junfeng Zhang is a notable inventor based in Singapore, SG. He has made significant contributions to the field of materials science, particularly in the lamination of fluoropolymers to metal and printed circuit board (PCB) substrates. His innovative methods have the potential to enhance the performance and durability of electronic components.

Latest Patents

Junfeng Zhang holds a patent for a method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate. This invention focuses on a technique for laminating fluoropolymers to metal surfaces, such as copper, gold, and platinum, as well as to PCB substrates at temperatures significantly lower than the sintering or melting points of the fluoropolymers. The method involves surface modification of fluoropolymers through thermal graft copolymerization while concurrently laminating metals in the presence of a functional monomer and an adhesive like epoxy resin. This process can be executed under atmospheric conditions without the need for an added polymerization initiator. The resulting laminated interfaces demonstrate T-peel strengths of no less than 8 N/cm, which can greatly improve adhesion between PCB substrates and metals.

Career Highlights

Throughout his career, Junfeng Zhang has focused on advancing the technology surrounding fluoropolymer applications. His work has been instrumental in developing methods that enhance the adhesion properties of materials used in electronic devices.

Collaborations

Junfeng Zhang has collaborated with notable colleagues, including Cheng Qiang Cui and Thiam Beng Lim, to further his research and innovations in the field.

Conclusion

Junfeng Zhang's contributions to the lamination of fluoropolymers represent a significant advancement in materials science, particularly for electronic applications. His innovative methods are poised to improve the performance and reliability of various electronic components.