Uiwang-si, South Korea

June-Ho Shin



Average Co-Inventor Count = 5.5

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Kumi, KR (2013)
  • Uiwang-si, KR (2013 - 2014)

Company Filing History:


Years Active: 2013-2014

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of June-Ho Shin

Introduction

June-Ho Shin is a prominent inventor based in Uiwang-si, South Korea. He has made significant contributions to the field of materials science, particularly in the development of advanced encapsulation materials for electronic devices. With a total of 4 patents to his name, his work has garnered attention for its innovative approaches and practical applications.

Latest Patents

Among his latest patents, June-Ho Shin has developed a polyorganosiloxane composition that serves as an encapsulation material for electronic devices. This composition includes a linear first polyorganosiloxane resin with specific chemical moieties, which enhances the performance and durability of electronic components. Additionally, he has created a transparent resin for encapsulation, derived from polymetallosiloxane, which is copolymerized with silicon compounds. These innovations are crucial for improving the reliability and efficiency of electronic devices.

Career Highlights

June-Ho Shin is currently associated with Cheil Industries Inc., where he continues to push the boundaries of material science. His work has not only advanced the technology used in electronic devices but has also contributed to the broader field of encapsulation materials. His expertise and innovative mindset have positioned him as a key player in his industry.

Collaborations

Throughout his career, June-Ho Shin has collaborated with notable colleagues, including Sang-Ran Koh and Sung-Hwan Cha. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

In summary, June-Ho Shin's contributions to the field of materials science, particularly in encapsulation materials for electronic devices, highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to enhancing the performance and reliability of electronic components, making him a significant figure in his field.

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