Juncheng Guo

Title: Juncheng Guo: Innovator in SIP Packaging Technology

Introduction

Juncheng Guo is a notable inventor based in Shandong, China. He has made significant contributions to the field of microelectronics, particularly in the area of System in Package (SIP) technology. His innovative approach has led to the development of a unique shielding process that enhances the performance and reliability of SIP packaging.

Latest Patents

Juncheng Guo holds a patent for a shielding process for SIP packaging. This patent discloses a method that includes providing a circuit board, cutting the covering layer to form half-cut trenches that separate different SIP packaging modules, and forming grooves in each single SIP packaging module. The process also involves creating a metal overlay on the outer surface of the SIP packaging module, which provides conformal shielding at the half-cut trenches and compartment shielding at the grooves. This innovative method culminates in the cutting of the half-cut trenches to obtain multiple separate SIP packaging modules.

Career Highlights

Guo is currently employed at Weifang Goertek Microelectronics Co., Ltd., where he applies his expertise in microelectronics to advance the company's technological capabilities. His work has been instrumental in developing solutions that meet the growing demands of the electronics industry.

Collaborations

Juncheng Guo collaborates with talented professionals in his field, including Dewen Tian and Qinglin Song. Their combined efforts contribute to the innovative projects at Weifang Goertek Microelectronics Co., Ltd.

Conclusion

Juncheng Guo's contributions to SIP packaging technology exemplify the spirit of innovation in the microelectronics industry. His patent for a shielding process showcases his commitment to enhancing product performance and reliability.