Beijing, China

Jun Nie

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2019-2021

Loading Chart...
Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations by Jun Nie: A Pioneer in Fingerprint Recognition and Wire Detection Technologies

Introduction

Jun Nie is an accomplished inventor based in Beijing, China. He has made significant contributions to the fields of fingerprint recognition and wire detection technologies. With a total of 4 patents to his name, his work continues to influence advancements in these areas.

Latest Patents

Jun Nie's latest patents include a fingerprint recognition module and a manufacturing method therefor, as well as a display panel and display apparatus. The fingerprint recognition module features a substrate with a fingerprint collection surface and a target surface. It includes a collection device located in a first groove on the target surface, and a fingerprint recognition circuit that collects information from the fingerprint collection surface. Additionally, he has developed a wire detection device and method, which consists of a chamber body with an electrode and particles arranged within it. This device applies an electric signal to wires being tested, enhancing the efficiency of wire detection.

Career Highlights

Throughout his career, Jun Nie has worked with notable companies such as Chengdu BOE Optoelectronics Technology Co., Ltd. and BOE Technology Group Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects.

Collaborations

Jun Nie has collaborated with talented individuals in his field, including Yuan Wu and Zheng Wang. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Jun Nie's contributions to fingerprint recognition and wire detection technologies exemplify his innovative spirit and dedication to advancing these fields. His patents and collaborations reflect a commitment to excellence and a vision for the future of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…