Hiratsuka, Japan

Jun Arakawa



Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2001-2011

Loading Chart...
Loading Chart...
4 patents (USPTO):Explore Patents

Title: Jun Arakawa: Innovator in Tire Technology

Introduction

Jun Arakawa is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of tire technology, holding a total of 4 patents. His work focuses on enhancing the performance and durability of pneumatic tires.

Latest Patents

One of Jun Arakawa's latest patents is for an innovative automobile tire tread. This pneumatic tire features a reinforcing rubber layer made of short fiber reinforced rubber. Alternatively, it includes a reinforcing rubber layer with hardness set in a range of 90° to 99° of JIS-A hardness. This layer is strategically arranged in the bead section from the bead toe section along the tire's inner wall surface. Additionally, a chafer composed of a non-metallic fiber cord with high strength and high elastic modulus is provided to cover the outer side of the reinforcing rubber layer from the tire inner wall surface to the bead toe area.

Career Highlights

Jun Arakawa is currently employed at The Yokohama Rubber Co., Ltd., a leading company in the tire manufacturing industry. His expertise in tire design and engineering has positioned him as a key player in the development of advanced tire technologies.

Collaborations

Throughout his career, Jun has collaborated with talented individuals such as Jun Shimada and Kenichiro Endou. These collaborations have fostered innovation and creativity in their projects.

Conclusion

Jun Arakawa's contributions to tire technology exemplify his dedication to innovation and engineering excellence. His patents reflect a commitment to improving the performance and safety of automotive tires.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…