Abbeville, France

Julien Lassalle


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2019

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Julien Lassalle in Downhole Technology

Introduction

Julien Lassalle is an accomplished inventor based in Abbeville, France. He has made significant contributions to the field of downhole technology, particularly through his innovative designs and patents. His work focuses on enhancing the efficiency and functionality of downhole packer assemblies.

Latest Patents

Julien Lassalle holds a patent for "Systems and methods for an expandable packer." This patent describes a downhole packer assembly that includes an outer skin and an inner packer. The inner packer is designed to expand the outer skin upon inflation. The assembly also features a pair of mechanical fittings at the axial ends of the outer skin and a ring assembly within at least one of the fittings. Notably, the ring assembly includes a shear pin that is configured to shear when a tensile force is applied to the downhole packer assembly. This innovative design enhances the operational capabilities of downhole equipment.

Career Highlights

Julien Lassalle is associated with Schlumberger Technology Corporation, a leading company in the oil and gas industry. His work at Schlumberger has allowed him to develop and refine technologies that are crucial for downhole operations. His patent reflects his commitment to advancing the field and improving the tools used in challenging environments.

Collaborations

Julien has collaborated with notable colleagues such as Pierre-Yves Corre and Lambert Rouchon. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Julien Lassalle's contributions to downhole technology through his patent for an expandable packer assembly demonstrate his expertise and dedication to innovation. His work continues to influence the industry and improve operational efficiencies in challenging environments.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…