Company Filing History:
Years Active: 2004
Title: Jui Ming Ni: Innovator in Semiconductor Technology
Introduction
Jui Ming Ni is a notable inventor based in Chu-Pei, Taiwan. She has made significant contributions to the field of semiconductor technology, particularly in the development of methods for forming electrically conductive bumps on semiconductor substrates.
Latest Patents
Jui Ming Ni holds a patent titled "Method for forming electrically conductive bumps and devices formed." This patent describes a method for creating electrically conductive bumps on a semiconductor wafer. The process involves providing a wafer with an active surface and conductive elements, followed by the deposition of metal layers and the application of insulating material bumps. The method ensures the effective formation of devices that enhance semiconductor functionality.
Career Highlights
Jui Ming Ni is associated with the Industrial Technology Research Institute, where she has been instrumental in advancing semiconductor technologies. Her innovative approach has led to the successful implementation of her patented methods in various applications.
Collaborations
Throughout her career, Jui Ming Ni has collaborated with esteemed colleagues, including Shyh-Ming Chang and Tai-Hong Chen. These partnerships have fostered a collaborative environment that promotes innovation and technological advancement.
Conclusion
Jui Ming Ni's contributions to semiconductor technology through her innovative patent demonstrate her expertise and commitment to advancing the field. Her work continues to influence the development of new technologies in the semiconductor industry.