Company Filing History:
Years Active: 2013
Title: Innovations by Jui-Chien Lien
Introduction
Jui-Chien Lien is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods and structures.
Latest Patents
Jui-Chien Lien holds a patent for a "Wafer level packaging method and a packaging structure using thereof." This invention discloses a method for packaging a first wafer and a second wafer, where the first wafer contains a MEMS element. The process involves forming through silicon vias, electrical interconnects, and bonding rings to ensure effective packaging and functionality.
Career Highlights
Jui-Chien Lien is affiliated with National Yang Ming Chiao Tung University, where he continues to advance research in semiconductor technologies. His work has garnered attention for its practical applications in the industry.
Collaborations
Jui-Chien Lien collaborates with Tsung-Lin Chen, who is also a prominent figure in the field. Their partnership enhances the research and development efforts in semiconductor packaging.
Conclusion
Jui-Chien Lien's contributions to wafer level packaging represent a significant advancement in semiconductor technology. His innovative methods and collaborative efforts continue to influence the industry positively.