Company Filing History:
Years Active: 2023
Title: Juan E. Dominguez: Innovator in System in Package Technology
Introduction
Juan E. Dominguez is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronics through his innovative work at Intel Corporation. His expertise lies in the development of advanced packaging technologies that enhance the performance and efficiency of electronic devices.
Latest Patents
Juan E. Dominguez holds 1 patent for a groundbreaking invention titled "System in Package with Interconnected Modules." This patent describes a system in package (SiP) that includes a package substrate and a modularized sub-package containing various electrical components. The invention allows for a unique arrangement of dies and interconnects, enabling efficient communication between components without the need for solder interconnects.
Career Highlights
Throughout his career, Juan has been instrumental in advancing packaging technologies at Intel Corporation. His work focuses on creating systems that optimize space and improve the functionality of electronic devices. His innovative approach has positioned him as a key player in the field of electronics packaging.
Collaborations
Juan E. Dominguez has collaborated with talented professionals such as Hyoung Il Kim and Bilal Khalaf. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Juan E. Dominguez is a distinguished inventor whose work in system in package technology has made a lasting impact on the electronics industry. His innovative solutions continue to shape the future of electronic device design and functionality.