Company Filing History:
Years Active: 2002
Title: Ju Yung Sohn: Innovator in Semiconductor Packaging
Introduction
Ju Yung Sohn is a notable inventor based in Inchon, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for forming ground vias in semiconductor packages.
Latest Patents
Ju Yung Sohn holds 1 patent for his invention titled "Methods for forming ground vias in semiconductor packages." This patent describes a tape ball grid array (TBGA) semiconductor package that features a one metal layer interconnect substrate. The method outlined in the patent includes several steps: defining at least one via hole through the substrate, filling the via hole with a first solder ball, reflowing the first solder ball, placing a second solder ball over the reflowed first solder ball, and reflowing the second solder ball to create a ground via connection to the ground plane of the TBGA.
Career Highlights
Ju Yung Sohn is currently employed at Signetics, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.
Collaborations
Throughout his career, Ju Yung Sohn has collaborated with talented individuals such as Seung Ryul Ryu and Marcos Karnezos. These collaborations have contributed to the successful development of various projects within the semiconductor industry.
Conclusion
Ju Yung Sohn's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.