Company Filing History:
Years Active: 2018
Title: Innovations of Ju-Seok Park in Plate Bonding Technology.
Introduction
Ju-Seok Park is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of bonding technologies, particularly through his innovative methods for thin plate assembly. His work is recognized for enhancing the efficiency and effectiveness of bonding processes.
Latest Patents
Ju-Seok Park holds a patent for a "Plate bonding method and plate assembly." This invention relates to a thin plate bonding method that includes coating with a coating material after increasing surface roughness. The method allows for diffusion bonding, achieving excellent bonding strength even at low temperatures and pressures. Additionally, it prevents thin plate deformation caused by thermal stress and ensures high air tightness by filling micro-pores with the coating material. He has 1 patent to his name.
Career Highlights
Ju-Seok Park is affiliated with the Korea Institute of Energy Research, where he continues to advance his research and development in energy-related technologies. His work has implications for various industries, including energy and manufacturing.
Collaborations
Some of his notable coworkers include Jong-Soo Park and Kyung-Ran Hwang, who contribute to the collaborative efforts in their research projects.
Conclusion
Ju-Seok Park's innovative approaches to plate bonding technology demonstrate his commitment to advancing engineering solutions. His contributions are vital for improving manufacturing processes and enhancing product quality.