Company Filing History:
Years Active: 1992
Title: Joseph A Apap: Innovator in Soldering Technology
Introduction
Joseph A Apap is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of soldering technology, particularly through his innovative patent that enhances the reliability of solder connections.
Latest Patents
Joseph A Apap holds a patent for "Substrate soldering in a reducing atmosphere." This invention presents an improved method and apparatus for creating solder connections from input/output connecting pins to the circuitry on a pinned metallized ceramic substrate. The process involves using a solder preform shaped like a sphere, which provides the correct volume of solder. These spheres are held in place at each desired joint by a template. The assembly of the substrate, solder sphere, and template is then passed through a furnace in a reducing atmosphere at a temperature that facilitates solder reflow and wetting. This method ensures a sound mechanical and electrical connection between the pin and its circuitry. The invention guarantees joints with a high degree of reliability, meeting acceptable soldering standards without compromising integrity. Additionally, it produces only harmless by-products and avoids residues that require chemical solvent cleaning, making it environmentally superior.
Career Highlights
Joseph A Apap is associated with International Business Machines Corporation (IBM), where he has contributed to advancements in technology through his innovative work. His career reflects a commitment to improving manufacturing processes and enhancing product reliability.
Collaborations
Throughout his career, Joseph has collaborated with notable colleagues, including Mark Alan Brown and Alan J Emerick. These collaborations have likely contributed to the development and refinement of his innovative ideas.
Conclusion
Joseph A Apap's contributions to soldering technology exemplify the impact of innovation in engineering. His patent not only enhances the reliability of solder connections but also promotes environmentally friendly practices in manufacturing.