Singapore, Singapore

Joo Yam Lau


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: **Innovative Thinker: Joo Yam Lau and His Contribution to Integrated Circuit Components**

Introduction

Joo Yam Lau, an inventive mind based in Pasir Ris, Singapore, holds a notable patent that showcases his ingenuity in the field of integrated circuits. His work significantly contributes to the efficient handling of electronic components, addressing challenges faced during storage and shipping.

Latest Patents

Joo Yam Lau is credited with one patent: an "Integrated circuit component carrier with angled supporting and retaining surfaces." This innovative carrier is designed for the storage and transportation of integrated circuit components. The design features multiple pocket portions, each tailored to support individual components securely. The base surface and sidewalls work together to ensure that components are retained in their designated pockets in a precise alignment, enhancing the reliability and efficiency of handling these delicate items during various processes.

Career Highlights

Joo currently works at E.pak International, Inc., where he continues to apply his expertise in the realm of integrated circuits. His dedication to innovation has positioned him as a significant figure in his company, where he plays a vital role in improving product design and functionality.

Collaborations

At E.pak International, Joo collaborates with talented individuals such as Song Ping Chen and Ru Zheng Liu. Together, they foster a creative environment conducive to innovation and technical advancement, spearheading projects that seek to enhance product offerings and market competitiveness.

Conclusion

Joo Yam Lau's contributions to integrated circuit technology highlight the importance of innovation in today’s fast-paced electronic landscape. With his patent, he has taken a significant step toward optimizing component handling, a critical factor in the manufacturing and distribution of electronic devices. His collaborative efforts with peers at E.pak International, Inc. promise a bright future for advancements in this field.

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