Company Filing History:
Years Active: 2021-2023
Title: Innovations by Jongrok Kim in Semiconductor Packaging
Introduction
Jongrok Kim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.
Latest Patents
Jongrok Kim's latest patents focus on advanced methods of manufacturing semiconductor packages. The first patent describes a method that involves preparing a core substrate with a cavity, where a passive component is placed. This method includes forming a first insulating layer that encapsulates the passive component and creating through-vias that connect the core substrate and the insulating layer. A first wiring layer is then formed to connect the through-vias and the passive component. Additionally, a connection structure with an insulating member is established, along with a redistribution layer that connects to the first wiring layer. A semiconductor chip is then placed on this structure, completing the package.
The second patent outlines a semiconductor package that consists of an interposer substrate, which includes a core substrate with a cavity and through-vias. This package also features a semiconductor chip with connection pads linked to a redistribution layer, a passive component housed in the cavity, and multiple insulating and wiring layers that facilitate connectivity and functionality.
Career Highlights
Jongrok Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the semiconductor industry. His work has contributed to the advancement of semiconductor technology, enhancing the efficiency and performance of electronic devices.
Collaborations
Throughout his career, Jongrok Kim has collaborated with talented coworkers, including Junghyun Cho and Youngsik Hur. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Jongrok Kim's contributions to semiconductor packaging through his innovative patents reflect his expertise and commitment to advancing technology. His work at Samsung Electronics Co., Ltd. continues to influence the industry positively.