Kyungki-do, South Korea

Jong-han Park


Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 87(Granted Patents)


Company Filing History:


Years Active: 1995-2002

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3 patents (USPTO):Explore Patents

Title: Jong-han Park: Innovator in Microelectronics

Introduction

Jong-han Park is a notable inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of microelectronics, particularly in the development of silver-tin alloy solder bumps. With a total of 3 patents to his name, Park continues to push the boundaries of innovation in his field.

Latest Patents

One of Jong-han Park's latest patents involves the fabrication of silver-tin alloy solder bumps. This process includes forming a masked underbump metallurgy layer on a microelectronic substrate to define exposed portions of the underbump metallurgy layer. Silver is plated on these exposed portions, followed by tin plating on the silver, and then reflowing to create the silver-tin alloy solder bumps. Notably, the silver-tin alloy is not plated directly; instead, individual layers of silver and tin are plated and then reflowed to achieve the desired alloy.

Another patent focuses on the methods of fabricating and testing silver-tin alloy solder bumps. This method mirrors the previous patent, emphasizing the innovative approach to creating reliable solder bumps for microelectronic applications.

Career Highlights

Jong-han Park is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in microelectronics. His work has been instrumental in advancing the technology used in electronic devices, contributing to the overall efficiency and reliability of microelectronic components.

Collaborations

Throughout his career, Park has collaborated with talented individuals such as Nam-jung Hur and Yong-hwan Kwon. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jong-han Park is a distinguished inventor whose work in silver-tin alloy solder bumps has made a significant impact in the microelectronics industry. His patents reflect a commitment to innovation and excellence, positioning him as a key figure in advancing technology.

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