Company Filing History:
Years Active: 2020
Title: Innovations by Jonas Zürcher
Introduction
Jonas Zürcher is a notable inventor based in Chur, Switzerland. He has made significant contributions to the field of interconnect technology, particularly through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of chip packages.
Latest Patents
Jonas Zürcher holds a patent for "Chip packages with sintered interconnects formed out of pads." This invention is directed to a method for interconnecting two components. The first component includes a first substrate and a set of structured metal pads arranged on a main surface. Each of the pads includes one or more channels, extending in-plane with an average plane of the pad, so as to form at least two raised structures. The second interconnect component includes a second substrate and a set of metal pillars arranged on a main surface. The structured metal pads are bonded to a respective, opposite one of the metal pillars, using metal paste. The paste is sintered to form porous metal joints at the level of the channels. Metal interconnects are obtained between the substrates. During the bonding, the metal paste is sintered by exposing the structured metal pads and metal pillars to a reducing agent. The channels and raised structures improve the penetration of the reducing agent.
Career Highlights
Jonas Zürcher is associated with International Business Machines Corporation (IBM), where he has been able to apply his innovative ideas in a collaborative environment. His work has contributed to advancements in the technology sector, particularly in the area of semiconductor packaging.
Collaborations
Throughout his career, Jonas has worked alongside talented individuals such as Thomas J Brunschwiler and Luca Del Carro. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Jonas Zürcher's contributions to the field of interconnect technology exemplify the spirit of innovation. His patent for chip packages with sintered interconnects showcases his ability to solve complex engineering challenges. His work continues to influence the industry and inspire future advancements.