John Ryan Holaday

Title: John Ryan Holaday: Innovator in Transient Liquid Phase Bonding

Introduction

John Ryan Holaday is a notable inventor based in Yorktown, IN (US). He has made significant contributions to the field of materials science, particularly in the processes of joining substrates through innovative techniques.

Latest Patents

Holaday holds a patent for a "Transient liquid phase bonding process and assemblies formed thereby." This patent focuses on processes that involve joining substrates via transient liquid phase bonding (TLPB). The method includes providing an interlayer of a low melting temperature phase (LTP) that consists of Sn and Bi between at least two substrates. By heating the substrates and the interlayer at a processing temperature equal to or above 200°C, the interlayer liquefies, allowing it to interact with high melting temperature phases (HTPs) of the substrates. This interaction results in isothermal solidification of the interlayer. The processing temperature is maintained long enough for the interlayer to be completely consumed, forming a solid bond between the substrates. Additionally, the patent covers assemblies formed by these processes.

Career Highlights

Holaday is associated with the Purdue Research Foundation, where he continues to advance his research and development efforts. His work has been instrumental in enhancing the understanding and application of bonding processes in various industries.

Collaborations

One of his notable collaborators is Carol Anne Handwerker, with whom he has worked on various projects related to materials science and engineering.

Conclusion

John Ryan Holaday's innovative work in transient liquid phase bonding showcases his expertise and commitment to advancing technology in materials science. His contributions are paving the way for new applications and improvements in substrate bonding processes.