Company Filing History:
Years Active: 1990-1996
Title: Innovations of John R Mankus
Introduction
John R Mankus is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of electronic components.
Latest Patents
One of his latest patents is for an electronic package assembly and connector designed to compress at least two circuitized substrates, including a ceramic substrate and multiple flexible substrates. This innovative package features a base member and an associated cover member that work together to secure the substrates in a protected and aligned manner. The design ensures that one of the substrates is substantially rigid and positively positioned within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate. The invention employs a resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is then secured to the base to effect final compression of the internal elements. This package can be positioned on and electrically coupled to another circuitized substrate, such as a PCB.
Career Highlights
John R Mankus is currently associated with International Business Machines Corporation (IBM). His work at IBM has allowed him to explore and develop innovative solutions in electronic packaging.
Collaborations
Some of his notable coworkers include Benson Chan and Fletcher L Chapin. Their collaborative efforts contribute to the advancement of technology in their field.
Conclusion
John R Mankus is a distinguished inventor whose work in electronic packaging has led to significant advancements in the industry. His innovative designs and patents continue to influence the development of electronic components.