Location History:
- Midland County, MI (US) (1992)
- Midland, MI (US) (1977 - 1993)
Company Filing History:
Years Active: 1977-1993
Title: John L Speier: Innovator in Siloxane Bond Technology
Introduction
John L Speier is a prominent inventor based in Midland, MI (US), known for his significant contributions to the field of siloxane bond technology. With a total of 17 patents to his name, Speier has made remarkable advancements in chemical processes that enhance the production and application of alkoxysilanes.
Latest Patents
Among his latest patents, one notable invention is the "Process for forming siloxane bonds." This innovative method involves reacting less than or equal to 1 equivalent of a carboxylic acid with 2 equivalents of alkoxy groups on an alkoxysilane in the presence of a strong acid. Another significant patent is the "Preparation of alkoxysilanes by contacting a solution of hydrogen." This process facilitates the preparation of alkoxysilanes by activating silicon with a solution of hydrogen fluoride in a liquid primary or secondary alcohol. The presence of hydrogen fluoride accelerates the formation of alkoxysilanes and allows for selective production of dialkoxysilanes and trialkoxysilanes, potentially using copper or a copper compound as a catalyst.
Career Highlights
John L Speier is currently associated with Dow Corning Corporation, where he continues to innovate and develop new chemical processes. His work has significantly impacted the field of materials science, particularly in the development of siloxane-based products.
Collaborations
Throughout his career, Speier has collaborated with notable colleagues, including James R Malek and William James Schulz, Jr. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
John L Speier's contributions to the field of siloxane bond technology exemplify the spirit of innovation. His patents and ongoing work at Dow Corning Corporation continue to influence advancements in chemical processes and materials science.