State College, PA, United States of America

John Johnson



Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: John Johnson - Innovator in Microelectronic Heat Dissipation

Introduction

John Johnson is an accomplished inventor based in State College, PA (US). He has made significant contributions to the field of microelectronics, particularly in addressing the challenges of heat dissipation in integrated circuit chips. His innovative approach has led to the development of a patented technology that enhances the performance and reliability of electronic devices.

Latest Patents

Johnson holds a patent for an "Advanced microelectronic heat dissipation package and method for its manufacture." This invention tackles the persistent issue of heat dissipation during the operation of integrated circuit chips. By embedding a heat pipe directly beneath the chip, the invention effectively transfers heat generated by the chip to points outside the enclosure. The manufacturing process involves powder injection molding to create a porous material that houses the working fluid, ensuring efficient heat management.

Career Highlights

Throughout his career, John Johnson has been associated with Advanced Materials Technologies Pte, Ltd., where he has applied his expertise in microelectronics. His work has not only contributed to the advancement of technology but has also positioned him as a key figure in the industry. His innovative solutions have garnered attention and recognition among peers and professionals alike.

Collaborations

Johnson has collaborated with notable colleagues, including Randall M German and Lye-King Tan. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

John Johnson's contributions to microelectronic heat dissipation represent a significant advancement in the field. His patented invention showcases his innovative spirit and commitment to solving complex engineering challenges. Through his work, he continues to influence the future of microelectronics and improve the performance of electronic devices.

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