Essex Junction, VT, United States of America

John Jay Maloney


Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 2005-2012

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6 patents (USPTO):

Title: **Innovative Contributions of Inventor John Jay Maloney**

Introduction

John Jay Maloney, an accomplished inventor based in Essex Junction, Vermont, has made significant strides in the realm of semiconductor technology. With a portfolio of six patents to his name, Maloney's work primarily focuses on advancements that enhance the reliability and efficiency of semiconductor chip carriers.

Latest Patents

Maloney's most recent innovations include two notable patents. The first is a "Quad flat no-lead chip carrier with standoff", which features an improved joint solder thickness for enhanced second-level attachment fatigue life. This innovation employs the copper leadframe of a QFN chip carrier to form rounded protrusions, simplifying the process of creating stand-offs. By increasing the wetting area and the quantity of solder, this design not only improves solder joint strength but also boosts thermal performance, thus ensuring better reliability of semiconductor devices.

The second patent revolves around "Heatplates for heatsink attachment for semiconductor chips." This innovative apparatus consists of a substrate and a semiconductor chip, which is physically attached to the substrate. The heat sink utilized in the design is placed on top of a lid that contains a thermally conductive material, effectively managing heat and enhancing overall thermal performance.

Career Highlights

John Jay Maloney has dedicated his career to cutting-edge research and development at the International Business Machines Corporation (IBM). His expertise in the semiconductor industry has not only led to the filing of multiple patents but has also contributed to the enhancement of manufacturing processes and product reliability.

Collaborations

Throughout his career, Maloney has collaborated with esteemed colleagues such as Elie Awad and Robert M. Smith. This teamwork reflects the collaborative spirit within IBM, where innovative ideas thrive through shared expertise.

Conclusion

John Jay Maloney stands out as a significant figure in innovation within the semiconductor domain. His contributions, particularly through his latest patents, demonstrate his commitment to driving advancements that improve both functionality and efficiency in technology. As he continues his journey at IBM, we anticipate further groundbreaking inventions from this dedicated inventor.

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